A new material that has been developed as a potential substitute for current applications such as solar cell and semiconductor application is silver coated copper paste because of its high conductivity and relatively low cost. This paper will also consider main preparation techniques and characteristics of such composition as silver-coated copper paste and main fields of its application. The paste is a hybrid one and incorporates a layer of silver because while copper’s main benefit, conductivity, is extraordinary its drawback, corrosion, is a problem. Both electroplate and chemical reduction techniques are evaluated in terms of scalability and coating smoothness. Issues related to coating uniformity, sintering optimization, and the cost of production are cited as major limitations to the industrial application scale. It can be seen that the controlled microstructure, crystal structure and particle distribution in the product are critical in obtaining a high and stable performance at high operating temperatures in service. Potential uses in photovoltaic and semiconductor products are presented; it is shown that the introduced silver-coated copper paste has comparable electrical properties to conventional silver paste but requires considerably less money to purchase. To this end, the paper suggests improving the methods of applying the coating, optimizing the sintering process, and improving the ways to support environmentally friendly practices in the implementation of the technology.
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Shaikh Sabieh,
shaikhsabieh@outlook.com,
School of Integrated Circuits, Southeast University, Wuxi, 214000,
China.
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Longbing He,
helongbing@seu.edu.cn,
School of Electronic Science and Engineering, Southeast University, Nanjing, 210096,
China.
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Aurangzaib Muhammad,
maurangzeb420@qq.com,
School of Electrical Engineering, Southeast University, Nanjing, 210096,
China.
Shaikh Sabieh Longbing He Aurangzaib Muhammad “Silver-Coated Copper Paste: Properties Preparation Techniques and Applications in Solar Cells and Semiconductor Devices” International Journal of Engineering W Vol. 12 Issue 05 PP. 81-90 May 2025. https://doi.org/10.34259/ijew.25.12058190.
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, Longbing He
