Study of the Impact of Cerium Addition on the Microstructure and Properties of Tin- Silver (Sn-3.5Ag) Solder Alloy

Sharafat Ali; Muhammad Saqid; Muhammad Arif; Fawad Haider Khan

Study of the Impact of Cerium Addition on the Microstructure and Properties of Tin- Silver (Sn-3.5Ag) Solder Alloy

Sharafat Ali, Muhammad Sadiq, Muhammad Arif, Fawad Haider Khan

Vol. 11, Issue 05, PP. 105-110, May 2024

Keywords: Tin-Silver; cerium, microstructure, green environment, Intermettalic compounds, lead free solders

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Solders have a vast potential market and are involved in almost every manufacturing and engineering process, such as electronic circuit boards, automobile repair processes, and pipeline soldering. Lead-free solder alloy in the form of Tin-Silver Sn-3.5Ag is considered an excellent alternative to conventional Tin-Lead solder because of its good mechanical properties and less harmful environmental effects. However, some problems, like the formation of large intermetallic compounds associated with Sn-3.5Ag, need high attention. Hence, the growth of intermetallic compounds in the tin matrix is enhanced further at high temperatures; therefore, its effect on the mechanical properties becomes more substantial. Scanning electron microscopy was used to examine the microstructure of intermetallic compound particles. The elemental composition was confirmed using an energy-dispersive X-ray. The results were analyzed to study the effects of adding cerium in different compositions to Sn-3.5Ag, including its effect on making the microstructure more refined and coarser regarding IMCs existence and subsequent effects on mechanical properties. To overcome this problem, this study examines rare earth elements like cerium doping (0.1, 0.3, and 0.6) wt.% into Sn-3.5Ag to study the microstructure and subsequent mechanical properties. The study includes the examination of the microstructure and mechanical properties of novel alloys, namely Sn-3.5Ag, Sn-3.5Ag-0.1Ce, Sn-3.5Ag-0.3Ce, and Sn-3.5Ag-0.6Ce, to ensure the requirement for a green environment and make electronic materials, products, and processes as environmentally benign as possible.

Sharafat Ali, , Department of Mechanical Engineering, University of Engineering and Technology, Peshawar , Pakistan.
Muhammad Saqid, , Department of Mechanical Engineering, University of Engineering and Technology, Peshawar , Pakistan.
Muhammad Arif, , US-Pakistan Center for Advanced Study, University of Engineering and Technology Peshawar, Pakistan.
Fawad Haider Khan, , Department of Industrial Engg Peshawar, University of Engineering and Technology, Peshawar , Pakistan.

Sharafat Ali Muhammad Sadiq Muhammad Arif Fawad Haider Khan “Study of the Impact of Cerium Addition on the Microstructure and Properties Vol. 11 Issue 05 PP. 105-110 May 2024. https://doi.org/10.34259/ijew.24.1105105110.

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